Addex SIP (Single Inlet Plenum), introduced in 2024, is a patent-pending, dual-counterflow plenum design, which matches or exceeds the performance of Addex’s multi-inlet plenum. Available for rotating or stationary die systems.

Mounted between the die and air ring, Intensive Cooling achieves tremendously higher output rates of 30%-60%. High-quality film is assured by the enhanced stability of the bubble.

EGC (External Gauge Control) and icEGC (Intensive Cooling External Gauge Control) quickly correct film thickness variation automatically with the highest resolution. Proven to be the fastest on the market.

MGC (Manual Gauge Control) and icMGC (Intensive Cooling Manual Gauge Control) offer a cost-effective, selective adjustment to correct gauge deviation by as much as 25%-50%. LFR (Laminar Flow) and icLFR (Intensive Cooling Laminar Flow) are offered without gauge adjustment.

DIBC (Digital Internal Bubble Cooling) control provides the fastest reaction time in the industry to ensure precise bubble control. Addex’s new Intensive Cooling technology is available with Intensive Cooling-Compatible IBC hardware (icDIBC). Fast changeovers = reduced scrap.